 View Large
|
Product Name : | FMP-01 3 Layers Flexible PCB for Mobile Phone Application |
| Product Origin : | Hong Kong S.A.R., China | |
| Product Category : | Flexible PCBs | |
| More Products : | Click here! | |
| Contact Details : | Hong Yuen Electronics Ltd | |
| Product Code : | 001 |
Product Details
Layers: 1 to 12
Base materials: BT, Kapton, G10, FR4, CEM-3
Base copper thickness: 1/3 oz to 3 oz
Minimum thickness:
Double sided: 0.10mm/0.004 inches
Four layers: 0.40mm/0.016 inches
Six layers: 0.55mm/0.022 inches
Maximum panel size: 406 x 610mm/16 x 24 inches
Minimum hole diameter: 0.20mm/0.008 inches
PTH hole tolerance: 0.05mm/0.002 inches
Aspect ratio: 6:1
Blind or buried via: yes
Minimum line width: 0.051mm/0.002 inches
Minimum line spacing: 0.051mm/0.002 inches
Minimum bonding pitch: 0.181mm/0.007 inches (center to center)
Minimum SMT pitch: 0.40mm/0.016 inches (center to center)
Base materials: BT, Kapton, G10, FR4, CEM-3
Base copper thickness: 1/3 oz to 3 oz
Minimum thickness:
Double sided: 0.10mm/0.004 inches
Four layers: 0.40mm/0.016 inches
Six layers: 0.55mm/0.022 inches
Maximum panel size: 406 x 610mm/16 x 24 inches
Minimum hole diameter: 0.20mm/0.008 inches
PTH hole tolerance: 0.05mm/0.002 inches
Aspect ratio: 6:1
Blind or buried via: yes
Minimum line width: 0.051mm/0.002 inches
Minimum line spacing: 0.051mm/0.002 inches
Minimum bonding pitch: 0.181mm/0.007 inches (center to center)
Minimum SMT pitch: 0.40mm/0.016 inches (center to center)